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芯华章

芯华章

Private

Last Round

Strategic

Mar 13, 2023

Est. Valuation

$1.08B

Total Funding Raised

$122.68M

Company Overview

Developer of electronic design automation (EDA) software and systems for the integrated circuit industry.

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芯华章 Comparables

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芯华章 Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
StrategicMar 13, 2023
Series BNov 26, 2022
StrategicJan 5, 2022
VC RoundMay 13, 2021
Series AJan 25, 2021
Series A
Dec 9, 2020

芯华章 Filings

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芯华章 filings preview — column headings only; records require access
TypeDateAmount OfferedAmount SoldFilingPagesDownload

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Firmographic Details

Headquarters—
Year Founded2020
Last FundingMar 13, 2023

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