芯华章
PrivateLast Round
Strategic
Mar 13, 2023
Est. Valuation
$1.08B
Total Funding Raised
$122.68M
Company Overview
The latest recorded funding round for 芯华章 was a Strategic round in March 2023. 芯华章 has raised $122.68M.
Developer of electronic design automation (EDA) software and systems for the integrated circuit industry.
Historical Pricing
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芯华章 Comparables
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芯华章 Funding Rounds
Historical fundraising activity
| Round | Date | Amount Raised | Valuation | Investors | Sources |
|---|---|---|---|---|---|
| Strategic | Mar 13, 2023 | ||||
| Series B | Nov 26, 2022 | ||||
| Strategic | Jan 5, 2022 | ||||
| VC Round | May 13, 2021 | ||||
| Series A | Jan 25, 2021 | ||||
Series A | Dec 9, 2020 |
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芯华章 Filings
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| Type | Date | Amount Offered | Amount Sold | Filing | Pages | Download |
|---|
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