Xi'an Eswin Material Technology Co., Ltd.

Public

—N/Ahttps://www.eswinmaterial.com/

Xi'an Eswin Material Technology Co., Ltd. is now publicly traded

The data on this page reflects Xi'an Eswin Material Technology Co., Ltd.'s private-market history up to the point it went public, including its funding rounds, valuation, and investors.

Went Public

Nov 29, 2024

Last Round

Series C

Dec 9, 2022

Total Funding Raised

$1.71B

Company Overview

Xi'an Eswin Material Technology Co., Ltd. is a semiconductor materials company that manufactures 12-inch silicon polished wafers and epitaxial wafers for integrated circuits.

AI Layer

Non-AI

Keywords

12-inch silicon wafer manufacturer12-inch monocrystalline silicon polished wafer12-inch monocrystalline silicon epitaxial waferlarge-diameter silicon wafer supplysemiconductor wafers for IC manufacturingsilicon wafers for logic and memory chipssemiconductor material supplierimport substitution for semiconductor materialssilicon wafers for image sensors and power devicessemiconductor test wafers

Xi'an Eswin Material Technology Co., Ltd. Comparables

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Xi'an Eswin Material Technology Co., Ltd. Funding Rounds

Historical fundraising activity

Data table
Round	Date	Amount Raised	Valuation	Investors	Sources
IPO	Nov 29, 2024	Book a demo	Book a demo	Book a demo	Book a demo
Series C	Dec 9, 2022	Book a demo	Book a demo	Book a demo	Book a demo
Series B	Jul 30, 2021	Book a demo	Book a demo	Book a demo	Book a demo
Series A	Jan 31, 2019	Book a demo	Book a demo	Book a demo	Book a demo

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Xi'an Eswin Material Technology Co., Ltd. Investors

Notable investors and investment history

Xi'an Eswin Material Technology Co., Ltd. investors
Investor	Rounds
Beijing Singularity Power Investment Fund	Series B, Series A
IDG Capital	Series A
中信金石投资有限公司	Series B
CITIC Securities	IPO
Bohua Capital	Series A
CORE Capital	Series B
Hengxu Capital	Series C

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Xi'an Eswin Material Technology Co., Ltd. Filings

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Xi'an Eswin Material Technology Co., Ltd. filings preview — column headings only; records require access
Type	Date	Amount Offered	Amount Sold	Filing	Pages	Download

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Firmographic Details

Headquarters—

Year Founded2016

Last FundingDec 9, 2022

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